LINEAPELLE is the most important international trade fair dedicated to leather, accessories, components, synthetic materials, and models for footwear, leather goods, apparel, and furniture.

Visit MICAM Milano: the world’s leading event for fashionable, high-quality, innovative, and sustainable footwear.

MOMAD: the leading fashion, footwear, and accessories trade fair at IFEMA MADRID.

FESPA 2026 is the must-attend event for the printing industry. In May, it returns to Barcelona!

At Texprocess, international exhibitors present the latest machines, systems, processes, and services for the production of garments, textiles, and flexible materials in Frankfurt am Main.

Mind will participate in Empack and Logistics & Automation Porto 2026, taking place on April 22–23, 2026, at Exponor – Porto International Fair (Hall 6), in Leça da Palmeira (Matosinhos).

Visit us at Hall 5 | Booth S57, in the Zünd area, and discover solutions for composite materials.

Accelerator Actions Cycle | March 10 | São João da Madeira

Mind at Futurmoda 2026 – Showcasing MindCAD for the Footwear Industry Mind will be present at Futurmoda, one of the leading international trade fairs dedicated to components, materials and technology for the footwear industry.

Mind will be present at INFORCE 2026, a trade fair dedicated to the areas of Defense, Security and Civil Protection, taking place from February 12 to 14 at Exponor – Porto International Fair.

Mind will be present at C!Print Madrid, one of the leading international trade fairs dedicated to the Packaging & Graphic industries, closely following the trends, innovations, and technologies that are transforming the sector.

Mind will be at Orthopädie Schuh Technik 2025 in Cologne, on October 24–25, 2025, together with its distributor in Germany, Rebstock Consulting GmbH & Co. KG, to showcase the latest version of MindCAD for Orthopedics — an integrated 2D and 3D software solution that transforms the design and engineering of custom and orthopedic footwear through precision, automation, and digital innovation.