Mind will be present at Texprocess Americas at Hall / Stand #1101 - Equipment and Technology for the Development, Sourcing, and Production of Sewn Products, presenting the latest technological solutions for Apparel and Upholstery industries.
Mind will be present at C!Print Madrid, one of the leading international trade fairs dedicated to the Packaging & Graphic industries, closely following the trends, innovations, and technologies that are transforming the sector.
Mind will be at Orthopädie Schuh Technik 2025 in Cologne, on October 24–25, 2025, together with its distributor in Germany, Rebstock Consulting GmbH & Co. KG, to showcase the latest version of MindCAD for Orthopedics — an integrated 2D and 3D software solution that transforms the design and engineering of custom and orthopedic footwear through precision, automation, and digital innovation.
Mind is an official sponsor of iTechStyle Summit 2025, the leading international event for innovation and technology in the textile and clothing industry, organized by CITEVE.